Shenzhen Chinasky Laser Technology Co., Ltd. hi China rama uv laser cutting machine siamtu leh supplier zingah chuan a professional ber pawl a ni. Kan factory atangin kum 2 warranty nei uv laser cutting machine quality tha tak lei theih nan inring reng ang che. Customized order pawh kan pawm bawk.
Feature leh Advantage a awm bawk
Material zau tak nena inmilna
Laser dang nena hmanraw harsa tak tak, plastic, ceramics, glass, leh highly reflective metals copper leh aluminum te pawh a tha hle.
Motion System hmasawn tak tak te
High-precision linear motor leh galvanometer scanner te hian cutting path complex tak tak atan speed leh accuracy tluk loh a pe a ni.
Integrated Vision Alignment a ni
High-resolution camera te hian cut te chu fiducial mark emaw pattern emaw ah automatic in an hmuchhuak a, an align a, PCB leh semiconductor component te tan critical accuracy a tichiang a ni.
Processing Areas tihchangtlun a ni
Panel lian emaw array tam tak emaw tan 460 mm x 460 mm maximum laser working range zau tak a nei a, chubakah precision 50 mm x 50 mm small-feature processing area a nei bawk. He dual-range capability hian a danglam bikna a pe a, format lian-format materials processing atanga machining extremely intricate, miniature components with high accuracy thlengin a pe a ni.
Process Database fing tak a ni
Database zau tak hian client-te chu product tin tan cutting parameter library danglam bik siam leh save theihna a siamsak a ni. Hei hian kut hmanga tihsual a ti bo a, operator experience thliar lovin result flawless, repeatable a tichiang bawk.
A chakna sang tak-Speed Precision Motion System (XY-Axis) a ni.
High-performance motion platform hmanga thuam a ni a, 800 mm/s speed chak tak leh 1G acceleration sang tak a pe bawk. Hei hian positioning chak tak a siam a, non-cutting idle time nasa takin a tihtlem a, batch tenau leh lian production tan pawh overall throughput leh efficiency nasa takin a tipung a ni.
Software hman dan awlsam zawk
Software interface-ah hian "Selective Cutting," "Tool-Based Cutting," leh "Material-Specific Parameter Presets" te ang chi function awlsam tak tak a awm a. Hei hian complex job setup chu click tlemteah a ti awlsam a, operator training hun a ti tlem a, tihsual a awm loh nan a pui bawk.
Automated Production History & Recall hmanga tihchhuah a ni
System hian product tin cutting data kimchang chu automatic in a record vek a ni. Hna thlak danglam tur chuan operator-te chuan list atanga product hming an thlang mai a, parameter zawng zawng chu a rang thei ang bera recall theih a ni a, hei hian rapid changeover a siam thei a, proven product-te setup error a ti bo bawk.
Advanced Operator Management & Audit Trail chuan a pe a
Monitoring hmanrua chak tak tak nei Administrator te. System hian operator activity zawng zawng chu automatic in a log vek a, login/logout hun te, parameter tihdanglam zawng zawng te, leh cut file hman tawh zawng zawng history kimchang tak te pawh a log vek a ni. Hei hian full traceability leh accountability a tichiang a, quality control diagnostics-ah a pui bawk.
Dilna
- Semiconductor & IC hmanga thil siam chhuah te:Wafer dicing (singulation), silicon cutting, ceramic substrate cutting, leh lead frame siam dan te a ni.
- Flexible Electronics (FPC) hmanga thil siam: 1.1.Flexible Printed Circuit (FPC), coverlay, leh polyimide (PI) leh PET layer te tak te te chu chiang taka cut leh drilling a ni.
- Engineering dik tak: 1.1.Metal te tak te (copper, aluminum foils) te tan te, micro-electromechanical system (MEMS) siam te, leh mesh leh filter tha tak tak siam te.
- Consumer Electronics hmanga thil siam chhuah:Camera module, touch sensor, leh display component hrang hrang atan glass leh sapphire cutting; smartphone components te mark leh trim te a ni.
FAQ
Q: Engtin nge UV laser hian CO2 emaw fiber laser emaw aiin a cut danglam?
A: CO2 leh fiber laser hian a bul berah chuan heat hmangin material te chu a melt emaw vaporize emaw a ni a, UV laser erawh chuan "cold" process photo-ablation an tih a hmang thung. A wavelength tawi leh photon energy sang tak chuan material molecular bonds chu direct-in a titawp a, a chhehvela heat transfer tlem ber hmangin material chu chiang takin a paih chhuak a ni.
Q: UV laser hian eng material nge a cut tha ber?
A: UV laser hian thil nalh leh harsa tak tak chi hrang hrang cut-naah an thiam hle a, chung zingah chuan:
● Plastics & Polymers: Polyimide (PI), PET, PEEK, PTFE, leh engineering plastic dangte.
● Thin & Reflective Metals: Copper, aluminium, rangkachak, leh tangkarua foil te chu beam reflect lo.
● Ceramics: Alumina, zirconia, leh substrate thil dangte micro-cracking nei lo.
● Glass & Sapphire: Cut thianghlim, control theih leh chhe lo drilling atan.
● Semiconductor hmanrua: Silicon, gallium arsenide leh compound semiconductor dangte.
Q: UV laser cutting machine hi engtiang chiahin nge a dik?
A: UV laser cutting machine precision hi a sang hle. Focal light spot te ber pawh 20 um hnuai lam a ni thei a, a cutting edge pawh a te hle bawk. Machine te hian positioning accuracy ±3 um leh repeat accuracy ±1 um an nei thei a, system processing accuracy chu ±20 um a ni.
Q: "Cold cutting" tih dan hian a thatna bulpui berte chu engte nge ni?
A: A thatna ber chu
- No Thermal Damage: Kang, melting, leh heat-induced deformation a ti bo.
- Superior Edge Quality: Burr leh slag awm lovin wall smooth, straight a siam chhuak.
- Minimal HAZ: Cut chhehvel material integrity a humhim.
- Ability to Cut Heat-Sensitive Materials: Thermal laser hmanga tihchhiat tur thilte processing a ti thei.
Q: UV laser hmanga cut materials te hi typical thickness range chu engzat nge ni?
A: UV laser hi thil te tak te leh nalh tak takah ultra-precision work atan optimized a ni. Ideal range chu a tlangpuiin 1 micron atanga 1-2 mm thleng a ni a, chu chu material property a zirin a ni. Thir plate thuk tak tak emaw block emaw cut nan an siam lo.
Q: UV laser system hi hman a him em?
A: A dik tak zet. Laser hi safety interlocked cabinet-ah a inkhar kim vek a, hei hian a hnathawh laiin UV radiation tha lo tak a chhuak thei lo tih a tichiang a ni. Operator te chuan him takin parts te chu exposure risk awm lovin an load thei a, an unload thei bawk.
hot tags .: uv laser cutting machine, China uv laser cutting machine siamtu, supplier, factory
Technical Parameter hrang hrang te
|
Entawn tlak |
HT-UVC15 a ni |
|
Laser hmanga chakna hman a ni |
15 W |
|
Laser hmanga siam a ni |
UV Laser hmanga siam a ni |
|
Laser hmanga wavelength a ni |
355 nm a ni |
|
Single Process Area tih a ni |
50×50 mm a ni |
|
Processing Range zawng zawng |
460 mm × 460 mm (A duh angin a siam theih) |
|
CCD Auto-Alignment dikna |
±3 μm |
|
Auto-Focus hnathawh dan |
Awle |
|
XY-Axis Repositioning dikna |
±1 μm |
|
XY-Axis Positioning dikna |
±3 μm |
|
File Format hrang hrang a thlawp theih |
DXF, DWG, GBR, CAD leh a dangte pawh a awm bawk |
